Four semiconductor IC packaging and testing manufacturers heavily expansion – Semiconductor – electronics industry
United Technologies added IC packaging and testing plant expansion capacity, declared this year's capital expenditure reached 200 million U.S. dollars, for the second highest over the years, plus ASE (2311), SPIL (2325) and Powertech (6239) and three letters measuring the amount of capital spending this year maker, 4
Semiconductor IC packaging and testing manufacturers of more than 45 billion yuan this year, capital expenditures, IC packaging and testing industry, highlighting the second half of next year, promising semiconductor.
ASE capital expenditures this year reached 450 million U.S. dollars to 500 million U.S. dollars, is Taiwan's IC packaging and testing industry, most manufacturers of capital expenditure, does not exclude up to enhance; Siliconware also the size of 450 million U.S. dollars; force into about 300 million dollars. Total IC packaging and testing plant in Taiwan this year, four of which more than 45 billion yuan of capital expenditure, highlighting the industry is confident about the future semiconductors.
United Technologies Chairman Li Yongsong yesterday (9) days, this year the economy grew fairly obvious semiconductor, personal computer-related products not only significant growth in demand for communications products is more a result of smart phone applications to increase substantially to the overall robust demand for the semiconductor industry , capacity is tight. In response to orders surge to 7,500 million dollars of United Technologies acquired Rosary paper technology (ASAT) Dongguan plant, in February to take over, to United Technologies in 1999 to the fourth acquisition of the object. Liyong Song said, after taking over ASAT Dongguan factory, so that the joint science and technology have great room for growth in revenue this year is estimated to inject Dongguan factory revenue this year that could reach from 150 million to 160 million U.S. dollars. Plus Taiwan, the Shanghai plant and another seven factories in Thailand factory capacity utilization is also significantly boosted, United Technologies revenues this year expected to top one billion U.S. dollars, than last year as nearly Qi Cheng, and a record high.
Liyong Song said that revenue growth this year, the main momentum for the simulation
IC And communications IC's IC packaging and testing requirements, including analog IC revenue accounted for more than about 35%, about 45% of communication IC, memory, 20%.
In response to strong growth in semiconductors, the joint technology capital spending this year will reach 200 million U.S. dollars (about 6.3 billion NT), second only to 350 million U.S. dollars in 2006, is 1.85 times last year, which used to expand the package equipment accounted for 40% to 45%, 55% expansion of test equipment to 60%.
Compared with measurement at the focus of future focus on the expansion of testing machine, ASE, SPIL and IC packaging and testing power into other manufacturers, this year's capital spending will focus on packaging equipment in the expansion of production capacity.
Liyong Song stressed that experience Financial
Crisis, the world's IC packaging and testing plant has been eliminated, the whole and the financial stability and the hands of those who hold cash to the new wave of economic recovery in the semiconductor, grab more territory.
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