Stone informed: advanced packaging products and technologies, significant progre
Recent years, the global Semiconductor Giant almost all of mainland China established its own package production lines, international semiconductor packaging and testing companies in the mainland, production line, in general, in two ways, one is IDM (vertical integration model) Holding joint venture IC packaging and testing plant, such as Shenzhen STS , Infineon Suzhou, Shanghai Matsushita Semiconductor; one is self-built IC packaging and testing plant IDM, such as Freescale Tianjin factory, Intel Shanghai and Chengdu factory, although they mainly provide services for themselves, but in recent years have begun to frequently accept orders. These enterprises, technical strength, financial, customer resources, has obvious advantages, diverted a portion of the domestic market space, making high-end business become increasingly competitive.
To build competitive advantage in three areas
As a leader in semiconductor, Nantong Fujitsu's technological advantages with high-end, reliable product quality, high-quality service system, good Cooperation Reputation in the fierce market competition foothold, access to the development of space.
First, active integration into the global semiconductor industry chain. Nantong Fujitsu From its inception, to adhere to domestic and overseas markets and simultaneously to advance the implementation of the development of consciousness "to become the world's leading semiconductor companies in Nantong Fujitsu's customers" strategy works. We first put forward in the packaging and testing industry, "one-stop" service solutions, formed a large-scale domestic and overseas customers to provide Cong Chip Testing, assembly, final test and then to the comparative advantages of one-stop service, this advantage for our foreign customers for many resources and high-end orders. Currently, the world's largest semiconductor companies in the top 10 has eight high-end of our customers, the top 20 semiconductor companies are also more than half of our customers, Nantong Fujitsu has grown to the field of world high-end packaging and testing subcontractors, global semiconductor industry chain, indispensable part.
Second, always technical innovation. Participate in the international market competition, even with the service advantage is not enough, also need to adapt to the future development needs of technical advantages. Companies rely on technical innovation yielded fruitful results, in IC IC packaging and testing technology to achieve a dozen titles. This year, we developed a successful 12-inch New-WLP wafer level CSP packaging products and technologies, the world's first innovative use of technology, using the world's leading new materials, new technology, with more low-cost advantage. Can be said that the level of our technology has entered the ranks of the international mainstream, and our technological advances to meet the level of IC design continuously improve packaging capabilities. It is because of the persistent efforts on technical innovation, Nantong Fujitsu have strength, ability to participate in international competition.
Third, the opportunity to seize the industry. Personally do not believe there is a new trend in the semiconductor industry, IDM will focus on pre-investment enterprises Road, after the Road to gradually reduce the IC input, turn to the production areas of cooperation and IC packaging and testing outsourcing. International Financial The crisis, making this trend even more apparent. Forced a number of multinational semiconductor companies increase market competition, cost pressure, speed up the after-package production, orders to low cost regions, increased outsourcing and the transfer of its product momentum. In mainland China, Nantong Fujitsu is undoubtedly the best subjects for their outsourcing transfer. This year in June, we received comprehensive Fujitsu LQFP IC packaging and testing product lines is a good example of the transfer, in addition, we also seize the opportunity and the more well-known semiconductor companies to expand international cooperation.
Thus, IC IC packaging and testing industry is still great room for future development potential is also huge. We must firmly grasp this opportunity to accelerate the development of economies of scale, so that the technological level of enterprises continuously to a new level, and gradually narrow the gap with the world's semiconductor companies, further development of space.
Six R & D objectives and technological upgrading
Technology R & D, must be guided by the market. We have a large number of partners and customer base, our market research results provide a good application of the carrier. On the one hand, we are well-known semiconductor companies with foreign advanced packaging needs, to strengthen technical cooperation, research and development of products with broad market prospects.
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