Led Heat Dissipation Substrate Technology Trends Analysis 3
In recent years, aluminum panels, makes the circuit board heat dissipation system gradually improved, even gradually to be the deflection of the development of flexible circuit boards. On the other hand, LED crystal substrates also gradually reduce the thermal resistance towards the direction, the table of a common system, namely the domestic circuit board and LED board type and the main grain suppliers:
4, LED heat ceramic substrates introduced
How to reduce the LED substrate grain ceramic thermal resistance for the present to upgrade the efficiency of LED light one of the most important issues, but if they make their way lines can be divided into thick film ceramic substrate, low temperature co-fired ceramic, and thin film ceramic substrate 3 species, respectively, as follows:
4.1 thick film ceramic substrate
Thick-film ceramic substrate using screen printing technology is the production of the material produced by blade on substrate, after drying, sintering, laser and other steps to become, the major domestic manufacturers of thick film ceramic substrate for the Holy Stone, 9 Howe and others. Generally speaking, the screen printing method to make the lines as the sheet mesh network problems, prone to rough lines, the phenomenon of the position is not accurate. Therefore, the future size requirements for smaller and more sophisticated line of high-power LED products, but also demands to be accurate, or the eutectic or the manufacture of the LED flip chip products, the accuracy of thick-film ceramic substrates gradually inadequate.
4.2 Low Temperature Co-fired ceramic
Low temperature co-fired ceramic technology to ceramic as a substrate material, the lines are printed by screen printing on the substrate, re-integration of multi-layer ceramic substrate, and finally through the low-temperature sintering, and its major domestic manufacturers? Germany e,? Xin and others. The low temperature co-fired ceramic substrate layer of metal lines is made by screen printing process, the same problem may be caused due to the net in position error, in addition, multi-layer ceramic sintered laminated, but also consider the ratio of its contraction problem. Hence, if the low temperature co-fired ceramic for use in line on the bit precision required of the eutectic / flip-chip LED products, will be even more harsh.
4.3 Thin Film Ceramic Substrates
In order to improve the net in thick-film process, as well as multi-layer laminated sintering shrinkage ratio, the recent development of thin film ceramic substrate as the heat LED die substrate. Film substrate is the use of thermal sputtering, electrical / electrochemical deposition, and photolithography process produced, with:
(1) low temperature process (300 or less), avoid high-temperature material damage or the possibility of size variation;
(2) the use of photolithography process, so that more precise lines on the substrate;
(3) Metal lines easy to fall off … and so, so thin film ceramic substrates for high power, small size, high brightness LED, and require high accuracy on the position of the eutectic / flip chip packaging process. The Secretary for domestic mainly Ai Xin Bai electronics and electricity with the company, with a professional film ceramic substrate production.
5, LED product development trend of international manufacturers
At present the trend of LED product development, packaging manufacturers from the LED all LED products recently published observation that the power and size, high power, small size of the product for the current development of LED industry focus, and are using the ceramic substrate as the heat LED grain cooling means. Therefore, the ceramic substrate of high thermal power, small size of the LED product structure, has become a very important part of the following Table II shall be of LED products at home and abroad the latest development of major product categories with a simple compile.
6, Conclusion
To improve efficiency and service life of LED light, LED products to solve heat issues shall be one of the most important issues at this stage, LED industries are also in high-power, high brightness and small size to its LED product development focus, therefore, provide with its high heat resistance, precision measurements of the thermal substrate, but also become the substrate in the LED cooling trend.
Aluminum plate at this stage to replace the aluminum nitride substrate, or eutectic or flip chip process to replace the grain hit gold / substrate binding mode to achieve the development to enhance the efficiency of LED light mainstream. In this development trend, on the cooling circuit of the substrate itself is extremely demanding position accuracy requirements, and require high heat resistance, small size, good adhesion of metal lines and other features, the use of photolithography to produce thin film ceramic substrates heat, will be the promotion of high-power LED continuously to improve one of the important catalyst.
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