Multilayer Printed Circuit Board Immersion Gold Process Control Brief – PCB, PCB
I. Introduction Process The purpose of Immersion Gold Process is deposited on the surface of the printed circuit color stability, good brightness, coating formation, good solderability of nickel gold plating. Basic can be divided into four phases: pre-treatment (degreasing, micro-etching, activation, after the dip), Nickel, Immersion Gold, post-treatment (scrap washed, DI water washing and drying). […]